Seminar presents solutions to signal integrity problems using Maxwell
Spicelink 1.2 by Ansoft

How ground and power plane effects are changing basic design methodologies
to be discussed

PITTSBURGH, Pa., October 15, 1993 - Electronic design engineers will have
the opportunity to discover new features and enhancements of Maxwell
Spicelink Version 1.2 during a Oct. 27 seminar at Techmart, Santa Clara
CA.

Design engineers attending the seminar will learn how ground and power
planes, as well as transmission line effects, are changing basic design
methodologies. They will examine the underlying principles behind these
phenomena and see how Maxwell Spicelink offers an analysis solution to
these problems, saves engineering time and money, and helps increase
market share.

Zoltan Cendes, an internationally renowned authority on electromagnetic
field computation and professor of electrical and computer engineering at
Carnegie Mellon University Pittsburgh, Pa., will introduce the product and
discuss the technology incorporated into version 1.2 of Maxwell
Spicelink.

"Solving problems with ground planes using Maxwell Spicelink 1.2" is the
featured topic. Solutions to gridded grounds, partial planes, non-ideal
grounds, and power and ground structures with multiple sources and sinks
will be demonstrated and discussed. Solutions from packaging and
interconnect applications will also be shown.

New field solvers in Maxwell Spicelink 1.2 speed high-speed interconnect
analysis by a factor of 10 or more over previous versions. The product
simplifies electrical characterization of power and ground planes by the
addition of automatic SPICE model generation for structures with multiple
sources and sinks. Maxwell Spicelink includes a Multi-layer Interconnect
Modeler (MIM) that automatically generates 3D structures from multi-layer
planar structures in DXF or GDSII format for the Maxwell 3D solvers.

To register for the seminar or to receive additional information on Maxwell
Spicelink, please contact Laurie Richardson (412-261-3200) at Ansoft.

Ansoft Corporation has over 600 customers in the United States, Europe and
Asia Pacific, with customers in the semiconductor, communications,
computer, and aerospace sectors. Ansoft developed the microwave CAE tool,
the High-Frequency Structure Simulator (HFSS), sold worldwide by the
Hewlett-Packard Company. Ansoft entered the EDA market with Maxwell
Spicelink in 1992. Ansoft is a privately held company and headquartered at
Four Station Square, Suite 660, Pittsburgh PA 15219-1119 USA. Phone
412-261-3200. Fax 412-471-9427. Internet info@ansoft.com.

 ============================================================
 From the  'New Product Information'  Electronic News Service
 ============================================================
 This information was processed from data provided by the
 above mentioned company. For additional details, contact 
 the company at the address or telephone number indicated.
 OmniPage Pro is now used for converting all printed input! 
 ============================================================
 All submissions for this service should be addressed to:
 BAKER ENTERPRISES,  20 Ferro Dr,  Sewell, NJ  08080  U.S.A.
 Email: RBakerPC (AOL/Delphi), rbakerpc@delphi.com (Internet)
 ============================================================
